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2026-02-05
As AI and HPC chip sizes continue to expand rapidly, advanced packaging is facing multiple challenges, including area utilization efficiency, warpage control, and cost structure. Although traditional CoWoS technology has established a critical position in the high-performance computing market, the physical limitations of circular wafers and ABF substrates are gradually becoming more apparent, making panel-level packaging an inevitable next step. This article explains the development background and technical characteristics of CoPoS packaging, while also comparing the differences between CoPoS and earlier CoWoS and CoWoP technologies. By adopting square glass panels as the core of its CoPoS architecture, CoPoS addresses the needs of larger and more highly integrated packages through higher unit throughput and improved structural stability, while also driving a new wave of growth momentum across equipment makers and the broader supply chain.
# Stocks
# Taiwan
# Manufacturing Industry
# Editor's Pick
2025-08-26
Delta Electronics (2308) has evolved from a traditional electronic component manufacturer into a key player in the power supply market in recent years . This article outlines Delta’s four major business segments, global footprint, core clients, key competitors, and its future outlook. Delta stands to benefit from rising power demand driven by AI data centers. The company’s co-developed "Panama power architecture" , and water-cooling thermal management solutions have seen growing shipment volumes. Overall, Delta’s performance in AI-related products looks promising.
# Fundamental Analysis
2025-09-09
As global demand for computing power surges, silicon photonics technology has emerged in response. Among its applications, Co-Packaged Optics (CPO) stands out as one of the most prominent extensions. This article provides an in-depth overview of the advantages of CPO and its critical components, including the silicon photonic engine, external lasers, fiber arrays, polarization-maintaining fibers, and MPO connectors. It also introduces several key companies involved in the field and outlines the major anticipated applications of CPO in the future.
# USA
2026-03-23
As the industry advances toward the 2nm process node, WMCM has emerged as a key focus in advanced packaging. This article explores WMCM’s core technology principles, process architecture, and its differences compared with InFO and CoWoS. It also analyzes its advantages and limitations in high-density RDL, thermal performance, cost, and integration flexibility, and highlights key Taiwanese beneficiaries in the materials and equipment supply chain.
2026-04-16
As the importance of cooling systems has increased significantly, chip-level cooling emerging has also become a critical technology. This article focuses on advancements in TIM 2 materials and the development of gold-plated cold plates, explaining how the introduction of indium improves thermal efficiency while also creating chemical reaction challenges. Amid the trend, Taiwanese companies—such as Superior Plating Technology (8431.TW) —are well-positioned to enter the supply chain and capture new opportunities driven by AI server cooling upgrades.
2026-02-26
As Moore’s Law approaches its physical limits, the bottleneck in chip scaling is no longer confined to transistors—it increasingly lies in power delivery. Traditional front-side power delivery networks (FSPDN) ultimately constraining performance and power efficiency.To sustain progress in advanced process nodes, TSMC, Intel, and Samsung have each moved forward with backside power delivery network (BSPDN) technologies. This article analyzes the fundamentals of backside power delivery, introduces TSMC’s Super Power Rail (SPR), and compares it with Intel’s PowerVia and Samsung’s BSPDN solutions. It further explores two critical steps in implementing backside power delivery—wafer thinning and reclaimed wafers—and examines how these technological shifts could reshape the market and supply chain.
2025-01-10
SoIC (System-on-Integrated-Chips) is a high-density 3D stacking packaging technology developed by TSMC, leveraging through-silicon vias (TSV) and hybrid bonding to enable higher performance and lower power consumption in chip designs. SoIC holds significant potential for applications in artificial intelligence (AI), high-performance computing (HPC), and autonomous driving. As production capacity continues to expand, SoIC is projected to become a mainstream next-generation semiconductor packaging technology.
# Investment
2024-10-18
The Taiwan Carbon Exchange was inaugurated last year and officially launched carbon credit trading this year, enabling companies to reduce emissions through the transfer and trading of carbon credits, thereby promoting domestic carbon reduction. Carbon credits, carbon fees, and carbon taxes are all carbon pricing tools; carbon credits allow companies to trade emissions quotas, while carbon fees and taxes are charged based on emissions volume. Taiwan's carbon credit market is currently focused on voluntary transactions. Key beneficiary stocks include companies in carbon offset forestry, green energy production, carbon capture, and carbon auditing. As the world advances toward net-zero emissions, these related industries are expected to see growth opportunities.
# Financial Products
2026-05-05
As AI chip power consumption rises rapidly, GPU server cooling technology is shifting from traditional air cooling to direct liquid cooling, and further evolving toward Micro Channel Cold Plate (MCCP) and Micro Channel Lid (MCL) architectures. This article explains the technical limits of air cooling, liquid-to-air, and liquid-to-liquid cooling, while exploring how MCCP improves heat exchange efficiency and how MCL breaks through the TIM2 bottleneck by shortening the thermal transfer path. The article also discusses opportunities across the thermal management supply chain and the competitive advantages of key beneficiaries.
2025-04-24
Unlike CPUs and GPUs, ASICs (Application-Specific Integrated Circuits) are pre-configured for specific applications before manufacturing. These chips are highly customized in both design and production, tailored for targeted use cases. ASICs have seen rapid growth in the AI and cloud computing markets. In the context of LLM (Large Language Model) applications, while Nvidia maintains a strong advantage in the training phase through its mature CUDA ecosystem, ASICs are expected to demonstrate significant potential in the inference phase due to their unique product attributes. Over time, a complementary ecosystem is likely to emerge, where ASICs fill specific roles alongside GPUs. This article offers a concise overview of ASIC characteristics, business models, industry landscape, and future outlook.
