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2026-05-05
As AI chip power consumption rises rapidly, GPU server cooling technology is shifting from traditional air cooling to direct liquid cooling, and further evolving toward Micro Channel Cold Plate (MCCP) and Micro Channel Lid (MCL) architectures. This article explains the technical limits of air cooling, liquid-to-air, and liquid-to-liquid cooling, while exploring how MCCP improves heat exchange efficiency and how MCL breaks through the TIM2 bottleneck by shortening the thermal transfer path. The article also discusses opportunities across the thermal management supply chain and the competitive advantages of key beneficiaries.
# Stocks
# Taiwan
# Manufacturing Industry
# Semiconductors
# Electronics
# AI
2026-03-23
As the industry advances toward the 2nm process node, WMCM has emerged as a key focus in advanced packaging. This article explores WMCM’s core technology principles, process architecture, and its differences compared with InFO and CoWoS. It also analyzes its advantages and limitations in high-density RDL, thermal performance, cost, and integration flexibility, and highlights key Taiwanese beneficiaries in the materials and equipment supply chain.
# Editor's Pick
2026-06-17
As demand for AI servers continues to surge, passive components have evolved from supporting components into a key area of market focus. From MLCCs and resistors to power inductors, these fundamental electronic components play a critical role in ensuring the stable operation of AI servers, GPUs, and high-speed data transmission systems. This article explores the major categories of passive components, their functions, and industry trends, while examining how the AI boom is creating opportunities for specification upgrades and long-term structural growth across the passive components industry.
2026-08-17
As AI Factories and high-density GPU computing continue to expand rapidly, data center power infrastructure is reaching a critical turning point from traditional AC distribution toward 800VDC. NVIDIA’s latest white paper outlines several 800VDC deployment architectures, including Power Rack, Power Center, and Power Block, while incorporating technologies such as SSTs, SSCBs, and liquid-cooled power racks to lower the barriers to upgrading existing data centers. This article examines NVIDIA’s 800VDC technology roadmap, power architectures, and Rack Power Roadmap to explore the next stage of power infrastructure development for AI data centers.
# USA
2026-05-07
As a core driver behind the RISC-V instruction set, SiFive is rapidly emerging in the AI and data center markets, supported by its open architecture and high degree of customization. This article examines its business model and product strategy, highlighting its positioning in high-performance computing, edge AI, and automotive markets. It also explores the strategic rationale behind NVIDIA’s investment, including efforts to diversify beyond Arm and strengthen AI infrastructure integration. As the RISC-V ecosystem continues to expand, SiFive is increasingly becoming a critical player in the post-Arm era.
2025-12-15
The wafer production process includes design, front-end manufacturing, and back-end packaging and testing, with packaging being an essential step after wafer fabrication. This article provides an in-depth overview of the packaging industry's value chain—covering upstream packaging material suppliers, the differentiated business models of midstream wafer foundries, and downstream packaging service providers. It also briefly introduces key players at each stage. In addition to the value chain, the article discusses the current outlook and future prospects of the packaging industry, highlighting notable Taiwanese stocks such as TSMC (2330.TW) and Grand Process Technology (3131.TW).
# Fundamental Analysis
2023-09-05
Stock orders can be categorized into different aspects, primarily including price type, order duration, and order timing. The price type includes market orders and limit orders. For order duration, there are three options: ROD (Rest of Day), IOC (Immediate or Cancel), and FOK (Fill or Kill). The order time can be further categorized based on whether it is during market hours or after hours.
# Beginners Guide
# Financial Lessons
# Financial Tools
# Investment
# Financial Products
2025-09-09
As global demand for computing power surges, silicon photonics technology has emerged in response. Among its applications, Co-Packaged Optics (CPO) stands out as one of the most prominent extensions. This article provides an in-depth overview of the advantages of CPO and its critical components, including the silicon photonic engine, external lasers, fiber arrays, polarization-maintaining fibers, and MPO connectors. It also introduces several key companies involved in the field and outlines the major anticipated applications of CPO in the future.
2025-07-22
Sea Limited (NYSE: SE), headquartered in Singapore, operates across three core business segments: Shopee, its fast-growing e-commerce platform actively expanding into emerging global markets; Monee, a fintech platform that has evolved from a digital wallet into a full-scale payment and lending ecosystem; and Garena, its digital entertainment arm known for consistently releasing popular games. This article provides an in-depth overview of the company’s current revenue landscape and explores its future outlook along with potential competitive threats.
# Southeast Asia
# South America
# Technology
# Consumer Discretionary
2025-01-10
SoIC (System-on-Integrated-Chips) is a high-density 3D stacking packaging technology developed by TSMC, leveraging through-silicon vias (TSV) and hybrid bonding to enable higher performance and lower power consumption in chip designs. SoIC holds significant potential for applications in artificial intelligence (AI), high-performance computing (HPC), and autonomous driving. As production capacity continues to expand, SoIC is projected to become a mainstream next-generation semiconductor packaging technology.
