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2025-09-09
As global demand for computing power surges, silicon photonics technology has emerged in response. Among its applications, Co-Packaged Optics (CPO) stands out as one of the most prominent extensions. This article provides an in-depth overview of the advantages of CPO and its critical components, including the silicon photonic engine, external lasers, fiber arrays, polarization-maintaining fibers, and MPO connectors. It also introduces several key companies involved in the field and outlines the major anticipated applications of CPO in the future.
# Stocks
# USA
# Taiwan
# Manufacturing Industry
# Editor's Pick
2026-01-13
In 2026, the global economy is entering a new phase of “multi-speed and uneven” growth, with AI expected to remain a core engine driving macro momentum.In the U.S., consumption and employment continue to diverge. Sticky inflation and labor market restructuring are eroding the spending capacity of middle- and lower-income households, while credit risk is gradually surfacing. With limited room for rate cuts, market focus is shifting from valuation expansion to profitability and capital efficiency. AI investment is also moving from a “scale-first” to a “return-first” approach, with capital increasingly concentrated in players demonstrating sustainable, long-term competitiveness.
# Investment
# Financial Planning
# Investment Strategy
2025-08-26
Delta Electronics (2308) has evolved from a traditional electronic component manufacturer into a key player in the power supply market in recent years . This article outlines Delta’s four major business segments, global footprint, core clients, key competitors, and its future outlook. Delta stands to benefit from rising power demand driven by AI data centers. The company’s co-developed "Panama power architecture" , and water-cooling thermal management solutions have seen growing shipment volumes. Overall, Delta’s performance in AI-related products looks promising.
# Fundamental Analysis
2026-01-15
Continuing from the previous article, as AI enters its fourth year of development, the market is shifting from optimistic expectations to a more rigorous evaluation of actual performance. In 2026, investment focus is no longer just about whether a company is "related to AI," but rather about who can deliver irreplaceable structural value amid the surge in inference demand and increasing scrutiny on capital efficiency. This article will focus on the ASIC industry, analyzing which segments of the supply chain are most likely to become key beneficiaries in the next phase as AI moves from training to inference. It will also highlight the roles that relevant Taiwanese companies are expected to play in this transformation.
2025-06-04
Whether it's DRAM for short-term data buffering or Flash for long-term data storage, memory has become an essential building block in electronic systems. This article introduces the two major categories of memory—volatile and non-volatile—and explains their respective characteristics and application scenarios. It concludes with an overview of prominent memory companies in Taiwan and around the world, analyzing their current production capacities as well as potential future trends and outlooks.
# Financial Lessons
2025-01-10
SoIC (System-on-Integrated-Chips) is a high-density 3D stacking packaging technology developed by TSMC, leveraging through-silicon vias (TSV) and hybrid bonding to enable higher performance and lower power consumption in chip designs. SoIC holds significant potential for applications in artificial intelligence (AI), high-performance computing (HPC), and autonomous driving. As production capacity continues to expand, SoIC is projected to become a mainstream next-generation semiconductor packaging technology.
2026-01-26
In 2026, the U.S. Federal Reserve (Fed) will undergo key leadership changes, including a full rotation of FOMC voting members and a transition of the Chair—developments that will have significant implications for future interest rate policy. The four new rotating voting members are generally hawkish, with broad support for slowing or pausing rate cuts in order to observe subsequent developments in inflation and the labor market. In contrast, potential candidates for the next Fed Chair lean more dovish, arguing that there is still room for further rate cuts. Overall, the 2026 FOMC is expected to feature a structure in which rotating voting members are relatively hawkish, while Governors and potential Chair candidates are more dovish. While markets continue to expect the overall direction of rate cuts to remain intact, the actual pace and magnitude will depend heavily on inflation trends, labor market data, and evolving political factors.
# Macroeconomics
# Central Bank
# Federal Reserve
2026-01-19
Against the backdrop of rapidly rising AI compute demand and continuously increasing chip TDP, the thermal management industry is entering a critical technological inflection point. This article is the third installment of fiisual’s 2026 Outlook Series, focusing on the core structural changes in AI server cooling architectures and providing an in-depth analysis of how liquid cooling—driven by GB300 GPUs and AI ASICs—is officially becoming the mainstream cooling solution. The article compares the performance differences between air cooling and liquid cooling, explains the rising value content of key liquid-cooling components such as cold plates, QD, and CDU, and explores the growth drivers, technology roadmaps, and investment opportunities within Taiwan’s supply chain for the thermal industry in 2026.
2025-04-24
Unlike CPUs and GPUs, ASICs (Application-Specific Integrated Circuits) are pre-configured for specific applications before manufacturing. These chips are highly customized in both design and production, tailored for targeted use cases. ASICs have seen rapid growth in the AI and cloud computing markets. In the context of LLM (Large Language Model) applications, while Nvidia maintains a strong advantage in the training phase through its mature CUDA ecosystem, ASICs are expected to demonstrate significant potential in the inference phase due to their unique product attributes. Over time, a complementary ecosystem is likely to emerge, where ASICs fill specific roles alongside GPUs. This article offers a concise overview of ASIC characteristics, business models, industry landscape, and future outlook.
2026-02-05
As AI and HPC chip sizes continue to expand rapidly, advanced packaging is facing multiple challenges, including area utilization efficiency, warpage control, and cost structure. Although traditional CoWoS technology has established a critical position in the high-performance computing market, the physical limitations of circular wafers and ABF substrates are gradually becoming more apparent, making panel-level packaging an inevitable next step. This article explains the development background and technical characteristics of CoPoS packaging, while also comparing the differences between CoPoS and earlier CoWoS and CoWoP technologies. By adopting square glass panels as the core of its CoPoS architecture, CoPoS addresses the needs of larger and more highly integrated packages through higher unit throughput and improved structural stability, while also driving a new wave of growth momentum across equipment makers and the broader supply chain.
