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2026-04-16
As the importance of cooling systems has increased significantly, chip-level cooling emerging has also become a critical technology. This article focuses on advancements in TIM 2 materials and the development of gold-plated cold plates, explaining how the introduction of indium improves thermal efficiency while also creating chemical reaction challenges. Amid the trend, Taiwanese companies—such as Superior Plating Technology (8431.TW) —are well-positioned to enter the supply chain and capture new opportunities driven by AI server cooling upgrades.
# Stocks
# Taiwan
# Manufacturing Industry
2026-04-14
Grab’s $600 million acquisition of foodpanda’s Taiwan business has become one of the most closely watched deals in the food delivery sector in recent years. The transaction not only reflects Delivery Hero’s strategic asset restructuring under capital pressure, but also marks Grab’s official expansion beyond Southeast Asia into East Asia. As the market structure is set to evolve, Taiwan’s delivery industry may shift from a duopoly toward competition between diversified ecosystems, with the competitive focus moving away from price subsidies to platform integration, user experience, and long-term profitability.
# Southeast Asia
# Service Industry
2026-04-08
The optical communications industry is shifting from traditional telecom cycles to structural growth driven by AI data center demand. As AI clusters expand and high-performance computing requirements increase, key technologies such as 800G and 1.6T optical transceivers, silicon photonics, and co-packaged optics (CPO) are accelerating adoption, driving upgrades across the entire industry chain. With capital expenditures continuing to rise, optical communications is becoming a core pillar of AI infrastructure, though supply bottlenecks and geopolitical risks remain key factors to watch.
# USA
2026-04-02
Driven by demand for AI, cloud computing, and high-performance computing, the U.S. semiconductor industry is entering a new growth cycle. This article provides a comprehensive breakdown of the global market size, industry value chain, and key segments—including IP/EDA, IC design, equipment, and foundries—while incorporating the 2026 outlook and potential risks to help investors understand core industry trends and investment logic.
2026-03-25
At GTC 2026, NVIDIA presented a comprehensive blueprint for its transformation from a GPU supplier into an AI factory platform provider. Centered around the Vera Rubin system, the company integrates CUDA-X, its ecosystem, and the AI Factory architecture, while highlighting the growing importance of token economics and agentic AI in the inference era. As demand rises across data processing, inference architectures, and enterprise AI deployment, NVIDIA is expanding further through heterogeneous computing, the open-model Nemotron family, and the Omniverse simulation platform. The company is also extending its reach into physical AI and regional AI markets, outlining the future direction of AI infrastructure and industry development.
2026-03-23
As the industry advances toward the 2nm process node, WMCM has emerged as a key focus in advanced packaging. This article explores WMCM’s core technology principles, process architecture, and its differences compared with InFO and CoWoS. It also analyzes its advantages and limitations in high-density RDL, thermal performance, cost, and integration flexibility, and highlights key Taiwanese beneficiaries in the materials and equipment supply chain.
# Editor's Pick
2026-03-12
The Regional Comprehensive Economic Partnership (RCEP) is a regional integration framework led by ASEAN and is currently the largest free trade agreement in the world in terms of economic scale and population coverage. This article briefly introduces the member composition of RCEP and outlines its core framework, which covers areas such as trade in goods, trade in services and investment, and e-commerce. It also discusses the potential future developments of RCEP and the possible future impact on Taiwan.
# China
# Japan
# India
2026-02-26
As Moore’s Law approaches its physical limits, the bottleneck in chip scaling is no longer confined to transistors—it increasingly lies in power delivery. Traditional front-side power delivery networks (FSPDN) ultimately constraining performance and power efficiency.To sustain progress in advanced process nodes, TSMC, Intel, and Samsung have each moved forward with backside power delivery network (BSPDN) technologies. This article analyzes the fundamentals of backside power delivery, introduces TSMC’s Super Power Rail (SPR), and compares it with Intel’s PowerVia and Samsung’s BSPDN solutions. It further explores two critical steps in implementing backside power delivery—wafer thinning and reclaimed wafers—and examines how these technological shifts could reshape the market and supply chain.
2026-02-10
Building on the AI-driven bull run in technology stocks in 2025, U.S. equities entered early 2026 amid record-high sentiment, even as doubts began to surface over the efficiency of capital spending by major tech companies. Alphabet, Microsoft, Meta, and Amazon have sharply expanded AI-related CapEx. Despite strong revenue and earnings performance, the market is no longer willing to buy into the growth narrative alone. At the same time, rapid progress by Anthropic and AI agents is reshaping the valuation framework of the SaaS software industry. This article examines how AI capital expenditure, cash flow pressure, and breakthroughs at the application layer are collectively influencing the valuation direction of U.S. technology stocks in early 2026.
# Fundamental Analysis
2026-02-05
As AI and HPC chip sizes continue to expand rapidly, advanced packaging is facing multiple challenges, including area utilization efficiency, warpage control, and cost structure. Although traditional CoWoS technology has established a critical position in the high-performance computing market, the physical limitations of circular wafers and ABF substrates are gradually becoming more apparent, making panel-level packaging an inevitable next step. This article explains the development background and technical characteristics of CoPoS packaging, while also comparing the differences between CoPoS and earlier CoWoS and CoWoP technologies. By adopting square glass panels as the core of its CoPoS architecture, CoPoS addresses the needs of larger and more highly integrated packages through higher unit throughput and improved structural stability, while also driving a new wave of growth momentum across equipment makers and the broader supply chain.
