- Industry
What Is CoPoS? TSMC’s CoWoS Technology and Its Evolution Toward Panel-Level Packaging
As AI and HPC chip sizes continue to expand rapidly, advanced packaging is facing multiple challenges, including area utilization efficiency, warpage control, and cost structure. Although traditional CoWoS technology has established a critical position in the high-performance computing market, the physical limitations of circular wafers and ABF substrates are gradually becoming more apparent, making panel-level packaging an inevitable next step. This article explains the development background and technical characteristics of CoPoS packaging, while also comparing the differences between CoPoS and earlier CoWoS and CoWoP technologies. By adopting square glass panels as the core of its CoPoS architecture, CoPoS addresses the needs of larger and more highly integrated packages through higher unit throughput and improved structural stability, while also driving a new wave of growth momentum across equipment makers and the broader supply chain.
- Industry
What is WMCM? A New Technology for the 2nm Era?
As the industry advances toward the 2nm process node, WMCM has emerged as a key focus in advanced packaging. This article explores WMCM’s core technology principles, process architecture, and its differences compared with InFO and CoWoS. It also analyzes its advantages and limitations in high-density RDL, thermal performance, cost, and integration flexibility, and highlights key Taiwanese beneficiaries in the materials and equipment supply chain.
- Industry
What Is Backside Power Delivery Network (BSPDN)? The Technological Differences Among TSMC, Samsung, and Intel
As Moore’s Law approaches its physical limits, the bottleneck in chip scaling is no longer confined to transistors—it increasingly lies in power delivery. Traditional front-side power delivery networks (FSPDN) ultimately constraining performance and power efficiency.To sustain progress in advanced process nodes, TSMC, Intel, and Samsung have each moved forward with backside power delivery network (BSPDN) technologies. This article analyzes the fundamentals of backside power delivery, introduces TSMC’s Super Power Rail (SPR), and compares it with Intel’s PowerVia and Samsung’s BSPDN solutions. It further explores two critical steps in implementing backside power delivery—wafer thinning and reclaimed wafers—and examines how these technological shifts could reshape the market and supply chain.
- Industry
What Is CoPoS? TSMC’s CoWoS Technology and Its Evolution Toward Panel-Level Packaging
As AI and HPC chip sizes continue to expand rapidly, advanced packaging is facing multiple challenges, including area utilization efficiency, warpage control, and cost structure. Although traditional CoWoS technology has established a critical position in the high-performance computing market, the physical limitations of circular wafers and ABF substrates are gradually becoming more apparent, making panel-level packaging an inevitable next step. This article explains the development background and technical characteristics of CoPoS packaging, while also comparing the differences between CoPoS and earlier CoWoS and CoWoP technologies. By adopting square glass panels as the core of its CoPoS architecture, CoPoS addresses the needs of larger and more highly integrated packages through higher unit throughput and improved structural stability, while also driving a new wave of growth momentum across equipment makers and the broader supply chain.
- Industry
What is WMCM? A New Technology for the 2nm Era?
As the industry advances toward the 2nm process node, WMCM has emerged as a key focus in advanced packaging. This article explores WMCM’s core technology principles, process architecture, and its differences compared with InFO and CoWoS. It also analyzes its advantages and limitations in high-density RDL, thermal performance, cost, and integration flexibility, and highlights key Taiwanese beneficiaries in the materials and equipment supply chain.
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- News
2026/5/11
fiisual Biweekly Oil Report:US-Iran Peace Talks Break Down Again, Continuous Destocking of Crude Oil and Refined Products
Although the market experienced a rapid correction due to the US-Iran peace talks, ceasefire news, and expectations of shipping resumption, overall oil prices continue to fluctuate near high levels, reflecting the market's high sensitivity to supply disruption risks. Looking at the price trends over the past two weeks, international oil prices have pulled back from their highs, but intraday volatility has been extreme. Market sentiment continues to be repeatedly driven by military conflicts, diplomatic negotiations, and the transit situation in the Strait of Hormuz. At the same time, the latest US EIA data also shows that the global supply gap is rapidly reflecting in the physical market. US crude oil, gasoline, and distillate inventories have seen continuous and significant declines, export demand has noticeably heated up, and global oil inventories are rapidly depleting at a historically rare pace.
- Industry
2026/5/7
Who Is SiFive? A Key Semiconductor IP Player in the Rise of RISC-V
As a core driver behind the RISC-V instruction set, SiFive is rapidly emerging in the AI and data center markets, supported by its open architecture and high degree of customization. This article examines its business model and product strategy, highlighting its positioning in high-performance computing, edge AI, and automotive markets. It also explores the strategic rationale behind NVIDIA’s investment, including efforts to diversify beyond Arm and strengthen AI infrastructure integration. As the RISC-V ecosystem continues to expand, SiFive is increasingly becoming a critical player in the post-Arm era.
- Industry
2026/5/5
From MCCP to MCL: What Is Microchannel Cooling Technology, and Which Companies Could Benefit?
As AI chip power consumption rises rapidly, GPU server cooling technology is shifting from traditional air cooling to direct liquid cooling, and further evolving toward Micro Channel Cold Plate (MCCP) and Micro Channel Lid (MCL) architectures. This article explains the technical limits of air cooling, liquid-to-air, and liquid-to-liquid cooling, while exploring how MCCP improves heat exchange efficiency and how MCL breaks through the TIM2 bottleneck by shortening the thermal transfer path. The article also discusses opportunities across the thermal management supply chain and the competitive advantages of key beneficiaries.
- News
2026/4/27
fiisual Biweekly Oil Report: US-Iran Peace Talks Stall Again, IEA Significantly Downgrades Supply and Demand Growth Forecasts
Recent severe fluctuations in the international crude oil market, driven by geopolitical conflicts, have focused primarily on the risk of a blockade in the Strait of Hormuz and changes in supply shocks and risk premiums triggered by the progress of US-Iran negotiations. International oil prices surged due to the breakdown of US-Iran talks, the US naval blockade on Iranian ports, and the dual blockade of the Strait of Hormuz. Although oil prices experienced sharp short-term volatility due to ceasefire expectations and negotiation news, the overall range remains at elevated levels. On the other hand, the IEA and OPEC show clear divergence in their supply and demand outlooks: the former significantly downgraded demand and emphasized the risk of supply chain damage, while the latter maintained robust supply and demand growth expectations. In terms of inventories, the US inventory structure and refining activities also showed a divergent trend of "crude oil inventory builds, with consecutive significant draws in SPR and refined products," further supporting crack spreads and refining margins.
- Stock
2026/4/20
Valuation Model 101: How to Determine a Stock’s Intrinsic Value and Fair Price
In investment decision-making, relying solely on stock price movements is insufficient to accurately assess a company’s value. A more rational foundation can be established through systematic valuation methods. This article begins with the concept of intrinsic value, explaining the differences between book value and enterprise value, and illustrates how financial models integrate industry analysis, business models, and assumption building to derive a fair stock price. It also outlines common valuation approaches and their applications, helping investors build a comprehensive valuation framework and improve their ability to identify undervalued or overvalued stocks.
