- Industry
What Is Backside Power Delivery Network (BSPDN)? The Technological Differences Among TSMC, Samsung, and Intel
As Moore’s Law approaches its physical limits, the bottleneck in chip scaling is no longer confined to transistors—it increasingly lies in power delivery. Traditional front-side power delivery networks (FSPDN) ultimately constraining performance and power efficiency.To sustain progress in advanced process nodes, TSMC, Intel, and Samsung have each moved forward with backside power delivery network (BSPDN) technologies. This article analyzes the fundamentals of backside power delivery, introduces TSMC’s Super Power Rail (SPR), and compares it with Intel’s PowerVia and Samsung’s BSPDN solutions. It further explores two critical steps in implementing backside power delivery—wafer thinning and reclaimed wafers—and examines how these technological shifts could reshape the market and supply chain.
- Industry
What Are Passive Components? A Complete Guide to MLCCs, Capacitors, Resistors, Inductors, and Industry Trends
As demand for AI servers continues to surge, passive components have evolved from supporting components into a key area of market focus. From MLCCs and resistors to power inductors, these fundamental electronic components play a critical role in ensuring the stable operation of AI servers, GPUs, and high-speed data transmission systems. This article explores the major categories of passive components, their functions, and industry trends, while examining how the AI boom is creating opportunities for specification upgrades and long-term structural growth across the passive components industry.
- Industry
What is WMCM? A New Technology for the 2nm Era?
As the industry advances toward the 2nm process node, WMCM has emerged as a key focus in advanced packaging. This article explores WMCM’s core technology principles, process architecture, and its differences compared with InFO and CoWoS. It also analyzes its advantages and limitations in high-density RDL, thermal performance, cost, and integration flexibility, and highlights key Taiwanese beneficiaries in the materials and equipment supply chain.
- Industry
What Is Backside Power Delivery Network (BSPDN)? The Technological Differences Among TSMC, Samsung, and Intel
As Moore’s Law approaches its physical limits, the bottleneck in chip scaling is no longer confined to transistors—it increasingly lies in power delivery. Traditional front-side power delivery networks (FSPDN) ultimately constraining performance and power efficiency.To sustain progress in advanced process nodes, TSMC, Intel, and Samsung have each moved forward with backside power delivery network (BSPDN) technologies. This article analyzes the fundamentals of backside power delivery, introduces TSMC’s Super Power Rail (SPR), and compares it with Intel’s PowerVia and Samsung’s BSPDN solutions. It further explores two critical steps in implementing backside power delivery—wafer thinning and reclaimed wafers—and examines how these technological shifts could reshape the market and supply chain.
- Industry
What Are Passive Components? A Complete Guide to MLCCs, Capacitors, Resistors, Inductors, and Industry Trends
As demand for AI servers continues to surge, passive components have evolved from supporting components into a key area of market focus. From MLCCs and resistors to power inductors, these fundamental electronic components play a critical role in ensuring the stable operation of AI servers, GPUs, and high-speed data transmission systems. This article explores the major categories of passive components, their functions, and industry trends, while examining how the AI boom is creating opportunities for specification upgrades and long-term structural growth across the passive components industry.
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- Industry
2026/11/3
NVIDIA Vera Rubin Architecture: A Guide to Its Compute Trays and Rack Management Modules
How does the NVIDIA Vera Rubin NVL72 integrate GPUs, CPUs, memory, power delivery, and management systems to create a rack-scale AI computing platform? This article explains the functions of components such as HBM4, NVMe SSDs, power conversion modules, and out-of-band management, and how they work together. It also examines how data storage, power distribution, and equipment maintenance support large-scale model training, inference, and agentic AI.
- Industry
2026/11/3
OCP Global Summit: Advancing AI Infrastructure Through Optical Interconnects, Advanced Packaging, and Rack Architecture
The 2026 OCP Global Summit focused on advances in AI infrastructure, spanning optical interconnects, USFP, NPO and XPO, PTFE orthogonal backplanes, 3.5D advanced packaging, memory architectures, and CPU racks. These developments show how the industry is responding to demand from expanding AI compute workloads and agentic AI. This article reviews technology strategies from companies such as NVIDIA, AMD, Cisco, SK hynix, and HGGenuine, and examines how high-speed data transmission, power delivery, cooling, and system integration could shape next-generation data centers and create opportunities for Taiwan’s supply chain.
- Industry
2026/10/27
Anthropic Plans to List Under ANT: Can Its Rapid Growth Support a Trillion-Dollar Valuation?
Anthropic’s IPO plans have drawn market attention. This article reviews the revenue growth, enterprise customer expansion, financing, and compute spending commitments disclosed in its S-1 registration statement, and examines the IPO’s implications for the company’s funding flexibility, AI industry valuations, and supply chain. With rapid growth alongside substantial compute procurement, Anthropic’s ability to turn demand for its models into stable profits and cash returns will be key to how the market assesses its IPO valuation and long-term prospects.
- Product
2026/10/14
How to Use the fiisual Taiwan Stock Lab: From Industry Heatmaps to Stock Analysis
fiisual Taiwan Stock Lab brings together industry heatmaps, index trends, industry articles, and individual stock data, helping investors move from broad market trends to in-depth company analysis. This article explains how to compare industry and peer performance, and how to track a company’s operations through financial indicators, capital flows, financial statements, and related news. It also introduces features such as adding data to chart comparisons with a click, switching between quarterly and annual data, and pinning the latest figures—making research and data comparisons more efficient.
- News
2026/10/6
TSMC and Terafab in Partnership Talks: How Could Potential Structures Affect Funding and Management Control?
TSMC is reportedly evaluating a second major U.S. manufacturing campus in Texas and discussing a potential partnership with Elon Musk’s Terafab, though neither the investment nor the partnership structure has been finalized. This article examines Texas’s advantages as a potential location, differences in funding and management control between two possible partnership models, and comparisons with Japan’s JASM and the 2025 Intel joint venture rumors. It also highlights key considerations, including long-term purchase commitments, risk sharing, and control over technology.
