- Industry
What Is CoPoS? TSMC’s CoWoS Technology and Its Evolution Toward Panel-Level Packaging
As AI and HPC chip sizes continue to expand rapidly, advanced packaging is facing multiple challenges, including area utilization efficiency, warpage control, and cost structure. Although traditional CoWoS technology has established a critical position in the high-performance computing market, the physical limitations of circular wafers and ABF substrates are gradually becoming more apparent, making panel-level packaging an inevitable next step. This article explains the development background and technical characteristics of CoPoS packaging, while also comparing the differences between CoPoS and earlier CoWoS and CoWoP technologies. By adopting square glass panels as the core of its CoPoS architecture, CoPoS addresses the needs of larger and more highly integrated packages through higher unit throughput and improved structural stability, while also driving a new wave of growth momentum across equipment makers and the broader supply chain.
- Industry
What is WMCM? A New Technology for the 2nm Era?
As the industry advances toward the 2nm process node, WMCM has emerged as a key focus in advanced packaging. This article explores WMCM’s core technology principles, process architecture, and its differences compared with InFO and CoWoS. It also analyzes its advantages and limitations in high-density RDL, thermal performance, cost, and integration flexibility, and highlights key Taiwanese beneficiaries in the materials and equipment supply chain.
- Industry
What Is Backside Power Delivery Network (BSPDN)? The Technological Differences Among TSMC, Samsung, and Intel
As Moore’s Law approaches its physical limits, the bottleneck in chip scaling is no longer confined to transistors—it increasingly lies in power delivery. Traditional front-side power delivery networks (FSPDN) ultimately constraining performance and power efficiency.To sustain progress in advanced process nodes, TSMC, Intel, and Samsung have each moved forward with backside power delivery network (BSPDN) technologies. This article analyzes the fundamentals of backside power delivery, introduces TSMC’s Super Power Rail (SPR), and compares it with Intel’s PowerVia and Samsung’s BSPDN solutions. It further explores two critical steps in implementing backside power delivery—wafer thinning and reclaimed wafers—and examines how these technological shifts could reshape the market and supply chain.
- Industry
What Is CoPoS? TSMC’s CoWoS Technology and Its Evolution Toward Panel-Level Packaging
As AI and HPC chip sizes continue to expand rapidly, advanced packaging is facing multiple challenges, including area utilization efficiency, warpage control, and cost structure. Although traditional CoWoS technology has established a critical position in the high-performance computing market, the physical limitations of circular wafers and ABF substrates are gradually becoming more apparent, making panel-level packaging an inevitable next step. This article explains the development background and technical characteristics of CoPoS packaging, while also comparing the differences between CoPoS and earlier CoWoS and CoWoP technologies. By adopting square glass panels as the core of its CoPoS architecture, CoPoS addresses the needs of larger and more highly integrated packages through higher unit throughput and improved structural stability, while also driving a new wave of growth momentum across equipment makers and the broader supply chain.
- Industry
What is WMCM? A New Technology for the 2nm Era?
As the industry advances toward the 2nm process node, WMCM has emerged as a key focus in advanced packaging. This article explores WMCM’s core technology principles, process architecture, and its differences compared with InFO and CoWoS. It also analyzes its advantages and limitations in high-density RDL, thermal performance, cost, and integration flexibility, and highlights key Taiwanese beneficiaries in the materials and equipment supply chain.
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- Industry
2026/4/16
What Are Gold-Plated Cold Plates? An Introduction to Chip-Level Cooling Technology
As the importance of cooling systems has increased significantly, chip-level cooling emerging has also become a critical technology. This article focuses on advancements in TIM 2 materials and the development of gold-plated cold plates, explaining how the introduction of indium improves thermal efficiency while also creating chemical reaction challenges. Amid the trend, Taiwanese companies—such as Superior Plating Technology (8431.TW) —are well-positioned to enter the supply chain and capture new opportunities driven by AI server cooling upgrades.
- Industry
2026/4/14
Grab Acquires foodpanda Taiwan Business: A Key Move Reshaping the Food Delivery Market Landscape
Grab’s $600 million acquisition of foodpanda’s Taiwan business has become one of the most closely watched deals in the food delivery sector in recent years. The transaction not only reflects Delivery Hero’s strategic asset restructuring under capital pressure, but also marks Grab’s official expansion beyond Southeast Asia into East Asia. As the market structure is set to evolve, Taiwan’s delivery industry may shift from a duopoly toward competition between diversified ecosystems, with the competitive focus moving away from price subsidies to platform integration, user experience, and long-term profitability.
- News
2026/4/13
fiisual Biweekly Oil Report: US-Iran Lack Consensus, Negotiations Fail; EIA Forecasts Pessimistic Outlook
Following the two-week ceasefire agreement between the US and Iran and the decision to hold peace talks, the market turned optimistic. Expectations that the Strait of Hormuz might reopen became the main driver for a sharp drop in oil prices. However, the negotiations broke down due to a lack of consensus, raising the risk of further conflict escalation. Under the multiple constraints of blocked shipping, damaged infrastructure, and ongoing military activities, the price center of gravity will likely remain higher than pre-war levels. The latest EIA outlook explicitly points out that shipping disruptions caused by the Middle East conflict have forced regional oil producers to shut in wells and accumulate inventory. The scale of actual supply disruptions remains as high as millions of barrels per day. Consequently, the EIA has downgraded supply and demand growth rates while significantly upgrading its oil price forecasts.
- Industry
2026/4/8
Optical Communications Industry Chain: Critical Infrastructure in the AI Era
The optical communications industry is shifting from traditional telecom cycles to structural growth driven by AI data center demand. As AI clusters expand and high-performance computing requirements increase, key technologies such as 800G and 1.6T optical transceivers, silicon photonics, and co-packaged optics (CPO) are accelerating adoption, driving upgrades across the entire industry chain. With capital expenditures continuing to rise, optical communications is becoming a core pillar of AI infrastructure, though supply bottlenecks and geopolitical risks remain key factors to watch.
- Industry
2026/4/2
A Comprehensive Analysis of the U.S. Semiconductor Industry
Driven by demand for AI, cloud computing, and high-performance computing, the U.S. semiconductor industry is entering a new growth cycle. This article provides a comprehensive breakdown of the global market size, industry value chain, and key segments—including IP/EDA, IC design, equipment, and foundries—while incorporating the 2026 outlook and potential risks to help investors understand core industry trends and investment logic.
