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2026/3/12
The Regional Comprehensive Economic Partnership (RCEP) is a regional integration framework led by ASEAN and is currently the largest free trade agreement in the world in terms of economic scale and population coverage. This article briefly introduces the member composition of RCEP and outlines its core framework, which covers areas such as trade in goods, trade in services and investment, and e-commerce. It also discusses the potential future developments of RCEP and the possible future impact on Taiwan.
# Taiwan
# China
# Japan
# Southeast Asia
# India
2026/2/26
As Moore’s Law approaches its physical limits, the bottleneck in chip scaling is no longer confined to transistors—it increasingly lies in power delivery. Traditional front-side power delivery networks (FSPDN) ultimately constraining performance and power efficiency.To sustain progress in advanced process nodes, TSMC, Intel, and Samsung have each moved forward with backside power delivery network (BSPDN) technologies. This article analyzes the fundamentals of backside power delivery, introduces TSMC’s Super Power Rail (SPR), and compares it with Intel’s PowerVia and Samsung’s BSPDN solutions. It further explores two critical steps in implementing backside power delivery—wafer thinning and reclaimed wafers—and examines how these technological shifts could reshape the market and supply chain.
# Stocks
# USA
# Manufacturing Industry
# Editor's Pick
2026/2/5
As AI and HPC chip sizes continue to expand rapidly, advanced packaging is facing multiple challenges, including area utilization efficiency, warpage control, and cost structure. Although traditional CoWoS technology has established a critical position in the high-performance computing market, the physical limitations of circular wafers and ABF substrates are gradually becoming more apparent, making panel-level packaging an inevitable next step. This article explains the development background and technical characteristics of CoPoS packaging, while also comparing the differences between CoPoS and earlier CoWoS and CoWoP technologies. By adopting square glass panels as the core of its CoPoS architecture, CoPoS addresses the needs of larger and more highly integrated packages through higher unit throughput and improved structural stability, while also driving a new wave of growth momentum across equipment makers and the broader supply chain.
2026/2/3
After missing the surge in AI computing demand and facing setbacks in process-node execution, Intel is positioning its 18A node as a pivotal turning point to re-enter the advanced-manufacturing race. With core technologies such as RibbonFET (GAA) transistors, PowerVia backside power delivery, and High-NA EUV lithography, 18A not only carries hopes for a revival of Intel’s in-house processor roadmap, but is also viewed as a key bargaining chip for Intel Foundry Services to win tier-one customers. This article outlines the major technical elements and applications of the 18A process, compares Intel’s approach with TSMC and Samsung in the 2nm landscape, and assesses the challenges Intel may face going forward.
2026/1/19
This article focuses on the key industry under the 2026 AI outlook—memory. From the angles of supply contraction and shifts in demand structure, it analyzes how NAND, DRAM, and HBM—driven by AI data centers, high-performance computing, and enterprise storage—are moving into an industry cycle of broad-based undersupply. With manufacturers maintaining conservative capex, DDR4 entering EOL, the crowding-out effect from HBM intensifying, and AI-driven storage demand growing far beyond expectations, memory pricing has entered an upcycle since 2025 and is set to remain strong into 2026, making memory one of the most structurally advantaged core industries within AI infrastructure.
# Investment
# Financial Planning
# Investment Strategy
Against the backdrop of rapidly rising AI compute demand and continuously increasing chip TDP, the thermal management industry is entering a critical technological inflection point. This article is the third installment of fiisual’s 2026 Outlook Series, focusing on the core structural changes in AI server cooling architectures and providing an in-depth analysis of how liquid cooling—driven by GB300 GPUs and AI ASICs—is officially becoming the mainstream cooling solution. The article compares the performance differences between air cooling and liquid cooling, explains the rising value content of key liquid-cooling components such as cold plates, QD, and CDU, and explores the growth drivers, technology roadmaps, and investment opportunities within Taiwan’s supply chain for the thermal industry in 2026.
2026/1/15
Continuing from the previous article, as AI enters its fourth year of development, the market is shifting from optimistic expectations to a more rigorous evaluation of actual performance. In 2026, investment focus is no longer just about whether a company is "related to AI," but rather about who can deliver irreplaceable structural value amid the surge in inference demand and increasing scrutiny on capital efficiency. This article will focus on the ASIC industry, analyzing which segments of the supply chain are most likely to become key beneficiaries in the next phase as AI moves from training to inference. It will also highlight the roles that relevant Taiwanese companies are expected to play in this transformation.
2025/12/15
The wafer production process includes design, front-end manufacturing, and back-end packaging and testing, with packaging being an essential step after wafer fabrication. This article provides an in-depth overview of the packaging industry's value chain—covering upstream packaging material suppliers, the differentiated business models of midstream wafer foundries, and downstream packaging service providers. It also briefly introduces key players at each stage. In addition to the value chain, the article discusses the current outlook and future prospects of the packaging industry, highlighting notable Taiwanese stocks such as TSMC (2330.TW) and Grand Process Technology (3131.TW).
# Fundamental Analysis
LINE Pay Taiwan, leveraging the massive user base of the LINE messaging app, has gradually built a comprehensive ecosystem that spans payments, marketing, and financial services. This article provides a brief overview of LINE Pay’s development journey, breaks down its two major business models—B2B2C and B2B—and examines the changes following the end of its partnership with iPASS Money. As Taiwan’s cashless payment market continues to grow, the article also analyzes future market trends and compares LINE Pay’s strengths and weaknesses against competitors like JKOPay and PX Pay Plus.
2025/12/1
CPTPP (Comprehensive and Progressive Agreement for Trans-Pacific Partnership) is one of the most significant regional trade agreements in the Asia-Pacific region, currently encompassing 12 major member countries and accounting for approximately 13% of global GDP. This article provides a brief overview of CPTPP’s development history, core provisions, and its distinctions from RCEP. It also explains why Taiwan has actively sought to join in recent years. However, Taiwan faces several challenges in the application process, including political pressure from China, meeting the agreement’s high standards, and achieving consensus among existing member states. These factors will significantly impact Taiwan’s prospects for successfully joining CPTPP.
# Macroeconomics
# Africa
# Monetary Policy
