Sort Newest to Oldest
2026/5/7
As a core driver behind the RISC-V instruction set, SiFive is rapidly emerging in the AI and data center markets, supported by its open architecture and high degree of customization. This article examines its business model and product strategy, highlighting its positioning in high-performance computing, edge AI, and automotive markets. It also explores the strategic rationale behind NVIDIA’s investment, including efforts to diversify beyond Arm and strengthen AI infrastructure integration. As the RISC-V ecosystem continues to expand, SiFive is increasingly becoming a critical player in the post-Arm era.
# Stocks
# USA
# Manufacturing Industry
2026/5/5
As AI chip power consumption rises rapidly, GPU server cooling technology is shifting from traditional air cooling to direct liquid cooling, and further evolving toward Micro Channel Cold Plate (MCCP) and Micro Channel Lid (MCL) architectures. This article explains the technical limits of air cooling, liquid-to-air, and liquid-to-liquid cooling, while exploring how MCCP improves heat exchange efficiency and how MCL breaks through the TIM2 bottleneck by shortening the thermal transfer path. The article also discusses opportunities across the thermal management supply chain and the competitive advantages of key beneficiaries.
# Taiwan
2026/4/20
In investment decision-making, relying solely on stock price movements is insufficient to accurately assess a company’s value. A more rational foundation can be established through systematic valuation methods. This article begins with the concept of intrinsic value, explaining the differences between book value and enterprise value, and illustrates how financial models integrate industry analysis, business models, and assumption building to derive a fair stock price. It also outlines common valuation approaches and their applications, helping investors build a comprehensive valuation framework and improve their ability to identify undervalued or overvalued stocks.
# Beginners Guide
# Investment
# Fundamental Analysis
2026/4/16
As the importance of cooling systems has increased significantly, chip-level cooling emerging has also become a critical technology. This article focuses on advancements in TIM 2 materials and the development of gold-plated cold plates, explaining how the introduction of indium improves thermal efficiency while also creating chemical reaction challenges. Amid the trend, Taiwanese companies—such as Superior Plating Technology (8431.TW) —are well-positioned to enter the supply chain and capture new opportunities driven by AI server cooling upgrades.
2026/4/14
Grab’s $600 million acquisition of foodpanda’s Taiwan business has become one of the most closely watched deals in the food delivery sector in recent years. The transaction not only reflects Delivery Hero’s strategic asset restructuring under capital pressure, but also marks Grab’s official expansion beyond Southeast Asia into East Asia. As the market structure is set to evolve, Taiwan’s delivery industry may shift from a duopoly toward competition between diversified ecosystems, with the competitive focus moving away from price subsidies to platform integration, user experience, and long-term profitability.
# Southeast Asia
# Service Industry
2026/4/8
The optical communications industry is shifting from traditional telecom cycles to structural growth driven by AI data center demand. As AI clusters expand and high-performance computing requirements increase, key technologies such as 800G and 1.6T optical transceivers, silicon photonics, and co-packaged optics (CPO) are accelerating adoption, driving upgrades across the entire industry chain. With capital expenditures continuing to rise, optical communications is becoming a core pillar of AI infrastructure, though supply bottlenecks and geopolitical risks remain key factors to watch.
2026/4/2
Driven by demand for AI, cloud computing, and high-performance computing, the U.S. semiconductor industry is entering a new growth cycle. This article provides a comprehensive breakdown of the global market size, industry value chain, and key segments—including IP/EDA, IC design, equipment, and foundries—while incorporating the 2026 outlook and potential risks to help investors understand core industry trends and investment logic.
2026/3/25
At GTC 2026, NVIDIA presented a comprehensive blueprint for its transformation from a GPU supplier into an AI factory platform provider. Centered around the Vera Rubin system, the company integrates CUDA-X, its ecosystem, and the AI Factory architecture, while highlighting the growing importance of token economics and agentic AI in the inference era. As demand rises across data processing, inference architectures, and enterprise AI deployment, NVIDIA is expanding further through heterogeneous computing, the open-model Nemotron family, and the Omniverse simulation platform. The company is also extending its reach into physical AI and regional AI markets, outlining the future direction of AI infrastructure and industry development.
2026/3/23
As the industry advances toward the 2nm process node, WMCM has emerged as a key focus in advanced packaging. This article explores WMCM’s core technology principles, process architecture, and its differences compared with InFO and CoWoS. It also analyzes its advantages and limitations in high-density RDL, thermal performance, cost, and integration flexibility, and highlights key Taiwanese beneficiaries in the materials and equipment supply chain.
# Editor's Pick
2026/2/26
As Moore’s Law approaches its physical limits, the bottleneck in chip scaling is no longer confined to transistors—it increasingly lies in power delivery. Traditional front-side power delivery networks (FSPDN) ultimately constraining performance and power efficiency.To sustain progress in advanced process nodes, TSMC, Intel, and Samsung have each moved forward with backside power delivery network (BSPDN) technologies. This article analyzes the fundamentals of backside power delivery, introduces TSMC’s Super Power Rail (SPR), and compares it with Intel’s PowerVia and Samsung’s BSPDN solutions. It further explores two critical steps in implementing backside power delivery—wafer thinning and reclaimed wafers—and examines how these technological shifts could reshape the market and supply chain.
# Investment Analysis
# Technical Analysis
# Chip Analysis
