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- Industry
2026/5/5
From MCCP to MCL: What Is Microchannel Cooling Technology, and Which Companies Could Benefit?
As AI chip power consumption rises rapidly, GPU server cooling technology is shifting from traditional air cooling to direct liquid cooling, and further evolving toward Micro Channel Cold Plate (MCCP) and Micro Channel Lid (MCL) architectures. This article explains the technical limits of air cooling, liquid-to-air, and liquid-to-liquid cooling, while exploring how MCCP improves heat exchange efficiency and how MCL breaks through the TIM2 bottleneck by shortening the thermal transfer path. The article also discusses opportunities across the thermal management supply chain and the competitive advantages of key beneficiaries.
- Industry
2026/3/23
What is WMCM? A New Technology for the 2nm Era?
As the industry advances toward the 2nm process node, WMCM has emerged as a key focus in advanced packaging. This article explores WMCM’s core technology principles, process architecture, and its differences compared with InFO and CoWoS. It also analyzes its advantages and limitations in high-density RDL, thermal performance, cost, and integration flexibility, and highlights key Taiwanese beneficiaries in the materials and equipment supply chain.
- Industry
2026/6/17
What Are Passive Components? A Complete Guide to MLCCs, Capacitors, Resistors, Inductors, and Industry Trends
As demand for AI servers continues to surge, passive components have evolved from supporting components into a key area of market focus. From MLCCs and resistors to power inductors, these fundamental electronic components play a critical role in ensuring the stable operation of AI servers, GPUs, and high-speed data transmission systems. This article explores the major categories of passive components, their functions, and industry trends, while examining how the AI boom is creating opportunities for specification upgrades and long-term structural growth across the passive components industry.
- Industry
2026/8/17
The Latest Evolution of Power Architectures: Insights from NVIDIA’s 800VDC White Paper
As AI Factories and high-density GPU computing continue to expand rapidly, data center power infrastructure is reaching a critical turning point from traditional AC distribution toward 800VDC. NVIDIA’s latest white paper outlines several 800VDC deployment architectures, including Power Rack, Power Center, and Power Block, while incorporating technologies such as SSTs, SSCBs, and liquid-cooled power racks to lower the barriers to upgrading existing data centers. This article examines NVIDIA’s 800VDC technology roadmap, power architectures, and Rack Power Roadmap to explore the next stage of power infrastructure development for AI data centers.
- Industry
2026/5/7
Who Is SiFive? A Key Semiconductor IP Player in the Rise of RISC-V
As a core driver behind the RISC-V instruction set, SiFive is rapidly emerging in the AI and data center markets, supported by its open architecture and high degree of customization. This article examines its business model and product strategy, highlighting its positioning in high-performance computing, edge AI, and automotive markets. It also explores the strategic rationale behind NVIDIA’s investment, including efforts to diversify beyond Arm and strengthen AI infrastructure integration. As the RISC-V ecosystem continues to expand, SiFive is increasingly becoming a critical player in the post-Arm era.
