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2026/10/6
TSMC is reportedly evaluating a second major U.S. manufacturing campus in Texas and discussing a potential partnership with Elon Musk’s Terafab, though neither the investment nor the partnership structure has been finalized. This article examines Texas’s advantages as a potential location, differences in funding and management control between two possible partnership models, and comparisons with Japan’s JASM and the 2025 Intel joint venture rumors. It also highlights key considerations, including long-term purchase commitments, risk sharing, and control over technology.
# USA
# Taiwan
# Japan
# Manufacturing Industry
# AI
# Semiconductors
2026/10/1
Hermes Testing (7856.TW), the highest-priced stock on Taiwan’s Emerging Stock Market, has officially debuted on the Taipei Exchange. Demand for AI chip testing is driving rapid growth in its cooling module, probe card, and equipment businesses. This article examines the company’s three core businesses, thermal management solutions for high-power AI chips, and expansion into CPO and advanced packaging equipment. It also compares Hermes Testing with peers such as MPI, WinWay, and Chunghwa Precision Test Tech., highlighting growth drivers and risks to monitor.
2026/9/10
SEMICON Taiwan 2026 highlights key technologies including AI chips, advanced packaging, FOPLP, silicon photonics-based CPO, and HBM. As AI computing power continues to increase rapidly, industry bottlenecks are shifting from individual chip performance toward memory bandwidth, chip-to-chip I/O, data transmission, and thermal efficiency. Drawing on key trends from the exhibition, this article examines the move toward larger advanced packaging formats, CPO mass production, AI memory architectures, and growing demand for testing, semiconductor equipment, and fab consumables, while identifying new growth opportunities across Taiwan’s semiconductor supply chain.
# Electronics
2026/8/20
Chinese AI startup Moonshot AI has launched Kimi K3, featuring 2.8 trillion parameters, a one-million-token context window, and architectural innovations including KDA, AttnRes, and MoE. Its overall performance is close to the world’s leading AI models while maintaining more competitive inference costs. K3 quickly reached its computing capacity limit after launch, reinforcing the implications of Jevons’ Paradox: greater model efficiency does not necessarily reduce computing demand and may instead accelerate AI Agent adoption, further driving demand for GPUs, HBM, DDR5, and enterprise SSDs.
# China
2026/8/17
As AI Factories and high-density GPU computing continue to expand rapidly, data center power infrastructure is reaching a critical turning point from traditional AC distribution toward 800VDC. NVIDIA’s latest white paper outlines several 800VDC deployment architectures, including Power Rack, Power Center, and Power Block, while incorporating technologies such as SSTs, SSCBs, and liquid-cooled power racks to lower the barriers to upgrading existing data centers. This article examines NVIDIA’s 800VDC technology roadmap, power architectures, and Rack Power Roadmap to explore the next stage of power infrastructure development for AI data centers.
2026/8/11
Rapid growth in AI computing power is driving a surge in data center electricity demand, pushing the power supply industry from a mature market into a new upgrade cycle. This article examines how AI data center power architectures are evolving from traditional AC systems toward 800V HVDC high-voltage direct current, while also exploring key trends in natural gas generation, SOFC fuel cells, grid upgrades, and large power transformers. It also reviews the positioning of Taiwanese suppliers such as Delta Electronics and Kaori Heat Treatment, highlighting how AI infrastructure upgrades are reshaping the global power industry and creating new investment opportunities.
# Power Infrastructure
2026/7/28
Growing demand from AI servers, high-voltage power architectures, vehicle electrification, and industrial automation, combined with geopolitical developments and supply chain restructuring, has gradually shifted the Power semiconductors industry toward a seller’s market. This article examines the major power semiconductor product categories, end-use applications, and competitive landscape, while exploring how AI is driving higher demand for components such as MOSFETs, IGBTs, and SiC devices. It also assesses how Taiwanese suppliers, including PANJIT and APEC, may benefit from supply chain realignment.
# Stocks
# Automotive
2026/7/20
As demand for AI model training continues to surge, GPU computing power is evolving from a technology resource into a standardized, tradable asset, paving the way for the emergence of GPU compute futures. This article explains how GPU compute futures work, their role in hedging and risk management, and the value they bring to the market. It also explores how AI developers, data center operators, and financial institutions can use futures contracts to manage fluctuations in compute pricing, while highlighting the latest initiatives from exchanges such as CME Group and Intercontinental Exchange (ICE). Discover how the financialization of computing power is shaping the next frontier of the AI economy.
# Trading
# Financial Products
# Futures
2026/7/16
Apple's decision to raise prices for products including Macs and iPads reflects more than just a pricing strategy—it highlights the growing cost pressures created by the global imbalance between memory supply and demand. This article examines the key drivers behind the sharp increase in DRAM and NAND prices, including AI-driven demand for HBM and enterprise SSDs, the concentrated supply among the three leading memory manufacturers, the rapid rise of Chinese memory makers, and Apple's strategic evaluation of Chinese suppliers. It also explores how developments in the memory industry are reshaping the consumer electronics market and the future competitive landscape of the global supply chain.
2026/7/14
ASML is the world's only company capable of mass-producing EUV lithography systems, making it the global leader in semiconductor manufacturing equipment and a key indicator of worldwide semiconductor capital spending and AI industry trends. This article explores ASML's position in the semiconductor industry, the differences between EUV and DUV technologies, and how demand for its equipment reflects capacity expansion in advanced process nodes and HBM. It also analyzes the company's latest financial performance, equipment orders, key takeaways from its earnings call, and the impact of AI, export controls, and global foundry investment on its future business outlook and the semiconductor industry cycle.
# Technology
# Communication Services
