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- Industry
2026/10/1
Hermes Testing (7856.TW) : Four Key Growth Drivers Across AI Cooling, Probe Cards, and CPO
Hermes Testing (7856.TW), the highest-priced stock on Taiwan’s Emerging Stock Market, has officially debuted on the Taipei Exchange. Demand for AI chip testing is driving rapid growth in its cooling module, probe card, and equipment businesses. This article examines the company’s three core businesses, thermal management solutions for high-power AI chips, and expansion into CPO and advanced packaging equipment. It also compares Hermes Testing with peers such as MPI, WinWay, and Chunghwa Precision Test Tech., highlighting growth drivers and risks to monitor.
- News
2026/9/14
Apple’s 2026 Product Launch: iPhone Duo Debuts as Premiumization and AI Drive a New Growth Curve
Apple’s 2026 fall product launch centers on its first foldable smartphone, the iPhone Duo, which enters the ultra-premium market with a starting price of US$1,999. Alongside the iPhone 18 Pro’s 2nm A20 Pro chip, variable-aperture camera, and thermal upgrades, Apple continues to push its product lineup further upmarket. Meanwhile, Apple Watch Series 12, AirPods 5, and the next-generation Siri further integrate Apple Intelligence, strengthening Apple’s AI-driven hardware and software ecosystem. For Taiwan’s supply chain, upgrades in advanced semiconductor processes, optics, thermal solutions, and foldable hinges are expected to increase component value per device, positioning TSMC, Hon Hai Precision, Largan Precision, Asia Vital Components , and Shin Zu Shing as key beneficiaries to watch.
- Industry
2026/9/10
SEMICON Taiwan 2026 Highlights: Four Key Trends in AI Advanced Packaging, FOPLP, CPO, and HBM
SEMICON Taiwan 2026 highlights key technologies including AI chips, advanced packaging, FOPLP, silicon photonics-based CPO, and HBM. As AI computing power continues to increase rapidly, industry bottlenecks are shifting from individual chip performance toward memory bandwidth, chip-to-chip I/O, data transmission, and thermal efficiency. Drawing on key trends from the exhibition, this article examines the move toward larger advanced packaging formats, CPO mass production, AI memory architectures, and growing demand for testing, semiconductor equipment, and fab consumables, while identifying new growth opportunities across Taiwan’s semiconductor supply chain.
- Industry
2026/8/20
How Kimi’s Low-Cost Model Is Reshaping AI Computing Demand
Chinese AI startup Moonshot AI has launched Kimi K3, featuring 2.8 trillion parameters, a one-million-token context window, and architectural innovations including KDA, AttnRes, and MoE. Its overall performance is close to the world’s leading AI models while maintaining more competitive inference costs. K3 quickly reached its computing capacity limit after launch, reinforcing the implications of Jevons’ Paradox: greater model efficiency does not necessarily reduce computing demand and may instead accelerate AI Agent adoption, further driving demand for GPUs, HBM, DDR5, and enterprise SSDs.
- Industry
2026/8/17
The Latest Evolution of Power Architectures: Insights from NVIDIA’s 800VDC White Paper
As AI Factories and high-density GPU computing continue to expand rapidly, data center power infrastructure is reaching a critical turning point from traditional AC distribution toward 800VDC. NVIDIA’s latest white paper outlines several 800VDC deployment architectures, including Power Rack, Power Center, and Power Block, while incorporating technologies such as SSTs, SSCBs, and liquid-cooled power racks to lower the barriers to upgrading existing data centers. This article examines NVIDIA’s 800VDC technology roadmap, power architectures, and Rack Power Roadmap to explore the next stage of power infrastructure development for AI data centers.
