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- News
2026/10/6
TSMC and Terafab in Partnership Talks: How Could Potential Structures Affect Funding and Management Control?
TSMC is reportedly evaluating a second major U.S. manufacturing campus in Texas and discussing a potential partnership with Elon Musk’s Terafab, though neither the investment nor the partnership structure has been finalized. This article examines Texas’s advantages as a potential location, differences in funding and management control between two possible partnership models, and comparisons with Japan’s JASM and the 2025 Intel joint venture rumors. It also highlights key considerations, including long-term purchase commitments, risk sharing, and control over technology.
- Industry
2026/10/1
Hermes Testing (7856.TW) : Four Key Growth Drivers Across AI Cooling, Probe Cards, and CPO
Hermes Testing (7856.TW), the highest-priced stock on Taiwan’s Emerging Stock Market, has officially debuted on the Taipei Exchange. Demand for AI chip testing is driving rapid growth in its cooling module, probe card, and equipment businesses. This article examines the company’s three core businesses, thermal management solutions for high-power AI chips, and expansion into CPO and advanced packaging equipment. It also compares Hermes Testing with peers such as MPI, WinWay, and Chunghwa Precision Test Tech., highlighting growth drivers and risks to monitor.
- Industry
2026/9/10
SEMICON Taiwan 2026 Highlights: Four Key Trends in AI Advanced Packaging, FOPLP, CPO, and HBM
SEMICON Taiwan 2026 highlights key technologies including AI chips, advanced packaging, FOPLP, silicon photonics-based CPO, and HBM. As AI computing power continues to increase rapidly, industry bottlenecks are shifting from individual chip performance toward memory bandwidth, chip-to-chip I/O, data transmission, and thermal efficiency. Drawing on key trends from the exhibition, this article examines the move toward larger advanced packaging formats, CPO mass production, AI memory architectures, and growing demand for testing, semiconductor equipment, and fab consumables, while identifying new growth opportunities across Taiwan’s semiconductor supply chain.
- Industry
2026/8/20
How Kimi’s Low-Cost Model Is Reshaping AI Computing Demand
Chinese AI startup Moonshot AI has launched Kimi K3, featuring 2.8 trillion parameters, a one-million-token context window, and architectural innovations including KDA, AttnRes, and MoE. Its overall performance is close to the world’s leading AI models while maintaining more competitive inference costs. K3 quickly reached its computing capacity limit after launch, reinforcing the implications of Jevons’ Paradox: greater model efficiency does not necessarily reduce computing demand and may instead accelerate AI Agent adoption, further driving demand for GPUs, HBM, DDR5, and enterprise SSDs.
- Industry
2026/8/17
The Latest Evolution of Power Architectures: Insights from NVIDIA’s 800VDC White Paper
As AI Factories and high-density GPU computing continue to expand rapidly, data center power infrastructure is reaching a critical turning point from traditional AC distribution toward 800VDC. NVIDIA’s latest white paper outlines several 800VDC deployment architectures, including Power Rack, Power Center, and Power Block, while incorporating technologies such as SSTs, SSCBs, and liquid-cooled power racks to lower the barriers to upgrading existing data centers. This article examines NVIDIA’s 800VDC technology roadmap, power architectures, and Rack Power Roadmap to explore the next stage of power infrastructure development for AI data centers.
